MAX9124ESE |
RFQ for MAX9124ESE Required Field |
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| Technical/Catalog Information | MAX9124ESE+ |
| Vendor | Maxim Integrated Products |
| Category | Integrated Circuits (ICs) |
| Number of Drivers/Receivers | 4/0 |
| Type | Driver |
| Voltage - Supply | 3 V ~ 3.6 V |
| Package / Case | 16-SOIC (3.9mm Width) |
| Packaging | Tube |
| Protocol | LVDS |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MAX9124ESE+ MAX9124ESE+ |
| Product | Manufacturers | Pack | D/C |
| MAX9124ESE | - | - | 06+ |
Typical Application |
Features |
| ·Digital Copiers DSLAMs·Laser Printers Network·Cell Phone Base Switches/Routers·Stations Backplane·Add/Drop Muxes Interconnect·Digital Cross-Connects Clock Distribution | Pin Compatible with DS90LV031A Guaranteed 800Mbps Data Rate 250ps Maximum Pulse Skew Conforms to TIA/EIA-644 LVDS Standard Single +3.3V Supply 16-Pin TSSOP and SO Packages |
VCC to GND...........................................................-0.3V to +4.0V
IN_, EN, EN to GND....................................-0.3V to (VCC + 0.3V)
OUT_+, OUT_- to GND..........................................-0.3V to +3.9V
Short-Circuit Duration (OUT_+, OUT_-).....................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Pin TSSOP (derate 9.4mW/°C above +70°C).........755mW
16-Pin SO (derate 8.7mW/°C above +70°C)................696mW
Storage Temperature Range.........................-65°C to +150°C
Maximum Junction Temperature....................................+150°C
Operating Temperature Range .......................-40°C to +85°C
Lead Temperature (soldering, 10s)...............................+300°C
ESD Protection
Human Body Model, OUT_+, OUT_-....................................±6kV
